Lamination of a photopolymerizable solder mask layer to a substa

Details Lamination of a photopolymerizable solder mask layer to a substa Lamination of a photopolymerizable solder mask layer to a substa

1991-12-20

1993-08-31

Rodee, Christopher D.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430312, 430324, 430328, 430330, 430273, 427 96, 156295, 1562737, G03C 558, G03F 716

Patent

active

052408175

ABSTRACT:
A process is disclosed for applying a preformed photopolymerizable solder mask film and a photosensitive liquid to a printed circuit substrate containing a plurality of holes wherein reduced failure is obtained in photopolymerized areas of the solder mask film above the holes as determined after a soldering operation. The photosensitive liquid contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a first photoinitiator system which has an absorption maximum in a first spectral region. The preformed photopolymerizable film contains at least one ethylenically unsaturated compound capable of forming a high polymer by addition polymerization and a second photoinitiator system, such that the preformed photopolymerizable film has an absorption maximum in a second spectral region and is activated by actinic radiation therein and has an absorption minimum in the first spectral region and transmits actinic radiation therein.

REFERENCES:
patent: 3629036 (1969-02-01), Isaacson
patent: 4069076 (1978-01-01), Fickes
patent: 4293635 (1981-10-01), Flint et al.
patent: 4698294 (1987-10-01), Lau et al.
patent: 4710262 (1987-12-01), Weed
patent: 4966827 (1990-10-01), Sullivan

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