Lamination for printed photomask

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S005000, C430S270100, C430S273100, C430S319000, C430S322000, C430S330000, C430S331000

Reexamination Certificate

active

07955783

ABSTRACT:
A method for masking regions of photoresist in the manufacture of a soldermask for printed circuit boards is disclosed. Following application of photoresist over patterned traces on a substrate, a sheet-like thin film is applied over the photosensitive material. The thin film may adhere to the photosensitive material by way of the adhesive state of the photosensitive material or by way of an adhesive applied to the photosensitive material or the thin film or carried by the thin film. Digital mask printing may proceed on the surface of the thin film. The photosensitive material may then be exposed through the printed photomask, the thin film (with photomask) removed, and the photosensitive material developed.

REFERENCES:
patent: 5691395 (1997-11-01), Knudsen et al.
patent: 6462107 (2002-10-01), Sinclair et al.
patent: 6515186 (2003-02-01), Kane et al.
patent: 6625032 (2003-09-01), Ito et al.
patent: 6742884 (2004-06-01), Wong et al.
patent: 6872320 (2005-03-01), Wong et al.
patent: 6890050 (2005-05-01), Ready et al.
patent: 6972261 (2005-12-01), Wong et al.
patent: 7309563 (2007-12-01), Paul et al.
patent: 7374977 (2008-05-01), Yamazaki et al.
patent: 7498119 (2009-03-01), Limb et al.
patent: 7514637 (2009-04-01), En
patent: 7714069 (2010-05-01), Corcoran et al.
patent: 2005/0136358 (2005-06-01), Paul et al.
patent: 2006/0105492 (2006-05-01), Veres et al.
patent: 568841 (1993-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lamination for printed photomask does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lamination for printed photomask, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lamination for printed photomask will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2622785

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.