Laminated substrate, method of manufacturing the substrate,...

Details Laminated substrate, method of manufacturing the substrate,... Laminated substrate, method of manufacturing the substrate,...

2008-05-27

2008-05-27

Menz, Douglas M. (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S455000

Reexamination Certificate

active

07378332

ABSTRACT:
Provided are a bonding substrate whose defective bonding portion in a peripheral region of an active layer has been removed by a polishing applied thereto after a surface grinding, a manufacturing method of the same substrate and wafer periphery pressing jigs. After the surface grinding, a periphery removing polishing is applied from an active layer wafer side of a bonding wafer so that a peripheral region of the active layer may be removed and a central region thereof may be left un-removed. Consequently, a periphery grinding and a periphery etching according to the prior art can be eliminated. Furthermore, an etch pit on a circumferential face of a wafer which could be caused by the periphery etching and a contamination or a scratching in an SOI layer which could be caused by a silicon oxide film left un-ground-off can be prevented, thereby achieving high yield and low cost.

REFERENCES:
patent: 5152857 (1992-10-01), Ito et al.
patent: 6174222 (2001-01-01), Sato et al.
patent: 2001/0029150 (2001-10-01), Kimura et al.
patent: 0 935 280 (1999-08-01), None
patent: 1 189 266 (2002-03-01), None
patent: 2-181469 (1990-07-01), None
patent: 5-109678 (1993-04-01), None
patent: 5-226305 (1993-09-01), None
patent: 5-235007 (1993-09-01), None
patent: 2003-142439 (2003-05-01), None
patent: 00/63954 (2000-10-01), None
Mitani, Kiyoshi,Science of Silicon, Surface Science Technology Seriesvol. 3, UCS Semiconductor Substrate Technology Research Association, Realize Inc., pp. 465 and 467, Jun. 28, 1996.

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