Laminate for the formation of beam leads for IC chip bonding fea

Details Laminate for the formation of beam leads for IC chip bonding fea Laminate for the formation of beam leads for IC chip bonding fea

1988-01-21

1989-09-12

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430277, 430156, 430906, G03C 194, G03C 168

Patent

active

048659509

ABSTRACT:
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises

REFERENCES:
patent: 4107155 (1978-08-01), Fletcher et al.
patent: 4247623 (1981-01-01), Guild
patent: 4684599 (1987-08-01), DoMinh et al.

Affiliated with

Also associated with

Rating

Laminate for the formation of beam leads for IC chip bonding fea does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminate for the formation of beam leads for IC chip bonding fea, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminate for the formation of beam leads for IC chip bonding fea will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-915598