Laminate for the formation of beam leads for IC chip bonding

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430281, 430288, G03C 7075, G03F 709

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active

050988140

ABSTRACT:
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips comprising:

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