Laminate and multilayer printed circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428 96, 428114, 428245, 428288, 428290, 428327, 428265, 428266, 428267, 428901, 361746, 174148, 174256, 174258, B32B 700, B32B 302, B32B 512, B32B 516

Patent

active

056770456

ABSTRACT:
A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
Tsukada, K., "Plastic Composite Substrates", Circuit Technology, Ibiden Co., Ltd., 8:1, pp. 14-17, 1993.
Inoue et al., "Ceramic Composite Copper-Clad Laminates", Hitachi Chemical Report No. 13, Hitachi Chemical Industry Company Ltd., Jul. 1989.

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