Laminate and multilayer printed circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Including grain – strips – or filamentary elements in...

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428327, 442 59, 442 70, 442 74, 174148, 174258, 361746, 257673, 257675, 257734, 257737, B32B 512

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active

061140058

ABSTRACT:
A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.

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Tsukada, K., "Plastic Composite Substrates", Circuit Technology, Ibiden Co., Ltd., 8:1, pp. 14-17, 1993.
Inoue et al., "Ceramic Composite Copper-Clad Laminates", Hitachi Chemical Report No. 13, Hitachi Chemical Industry Company Ltd., Jul. 1989.

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