Kit for the assembly of a metal electronic package

Details Kit for the assembly of a metal electronic package Kit for the assembly of a metal electronic package

1990-01-08

1991-05-07

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 17GF, 357 74, H01L 2302

Patent

active

050138715

ABSTRACT:
A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.

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