Junction semiconductor device and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S213000, C257S347000, C257S352000, C257SE21170, C257SE21051, C257SE21123, C257SE21218, C257SE21229, C257SE21416

Reexamination Certificate

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07449734

ABSTRACT:
A junction semiconductor device having a drain region including a low-resistance layer of a first conductive type formed on one surface of a semiconductor crystal, a source region including a low-resistance layer of a first conductive type formed on the other surface of the semiconductor crystal, a gate region of a second conductive type formed on the periphery of the source region, a high-resistance layer of a first conductive type between the source region and the drain region, and a recombination-inhibiting semiconductor layer of a second conductive type provided in the vicinity of the surface of the semiconductor crystal between the gate region and the source region.

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patent: 2004/0135178 (2004-07-01), Onose et al.
patent: 2005/0029557 (2005-02-01), Hatakeyama et al.
2002 Report on the Results of Research, New Energy and Industrial Technology Development Organization, Development of Ultra Low Loss Power Devices Technology, and Device Design Technology, Research and Development Association for Future Electron Devices.
J. H. Zhao et al., 6A, 1kV 4H-SIC Normally-off Trenched-and-Implanted Vertical JFETs, Materials Science Forum, 2004, 1213-1216, 157-160, Trans Tech Publications, Switzerland.
Takahashi Shinohe et al., 600V5A 4H-SiC with Low RonS of 13mΩcm2, Proceedings of the Symposium on Static Induction Devices, 2002, 41-45, 17.

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