Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-11-13
1992-07-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156631, 156634, 156656, 1566591, 156667, 20419224, 505728, 505817, 505820, B44C 122, C23F 102
Patent
active
051319764
ABSTRACT:
A Josephson junction apparatus comprises a polymeric film having flexiblity, and a Josephson junction circuit formed on the polymeric film. The Josephson junction circuit includes a Josephson junction device and a wiring for connecting to the Josephson junction device. Namely, the Josephson junction apparatus has flexibility, and thus the Josephson junction apparatus can be placed not only on a flat surface but also it can be placed on a curved surface in practice. Furthermore, in the Josephson junction apparatus, when a functional polymeric film is used as a substrate of a Josephson junction of the Josephson junction device, a protective film is previously formed over the functional polymeric film, so that a wetting of the functional polymer film, which is caused by water or organic solvents being used used repeatedly during the manufacturing process, can be prevented and a dimensional stability of the film can be increased. Therefore, a minute Josephson junction can be formed onto the polymeric film without causing a dimentional discrepancy in pattern, and a reliability thereof can be increased.
REFERENCES:
patent: 3409466 (1968-11-01), Slay et al.
patent: 4412902 (1983-11-01), Michikami et al.
patent: 4956335 (1990-09-01), Agostinelli et al.
patent: 4964945 (1990-10-01), Calhoun
patent: 4988674 (1991-01-01), Mir et al.
H. Shibayama et al., "Formation of Low Defect Density SiO.sub.x Film for Josephson Integrated Circuits", Appl. Phys. Lett. 47(4), pp. 429-430, Aug. 15, 1985.
Fujitsu Limited
Powell William A.
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