Joined bodies and a method of producing the same

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S601000, C428S620000, C428S621000, C428S646000, C228S122100, C228S123100, C228S196000, C228S235200

Reexamination Certificate

active

07067200

ABSTRACT:
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.

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JP 2003-080375 English Machine Translation, Fujii, Manufacturing Method of Semiconductor Wafer Supporting Member Joined Body and Semiconductor Wafer Supporting Member Joined Body, Mar. 2003.
JP 08-008330 English Machine Translation, Miyata Giken YG, Jan. 1996.
U.S. Appl. No. 10/374,818, filed Feb. 25, 2003, Fujii.

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