Jig for peeling a bonded wafer

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se

Patent

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Details

156344, 29239, 294265, B32B 3500

Patent

active

058977430

ABSTRACT:
A peeling jig is provided for peeling a bonded wafer having voids formed in bonding surfaces so as to rebond, which does not injure the bonding surfaces or cause the adherence of particles thereto. The peeling jig includes a wedge portion 1a for inserting into the bonding surfaces, and a flat portion provided at the both sides of the base of the wedge portion. The apex angle of the wedge portion, when the chamfered angles at the bonding sides of the supporting substrate and active wafer of the bonded wafer to be separated are respectively .alpha. and .beta., is .theta. and .theta.>.alpha.+.beta.. When the wedge portion is inserted into the bonding surfaces, the right and left inclined surfaces of the wedge portion are in contact with the peripheries of the chamfered portions, and then chamfered portions are flared. Accordingly, the bonded wafer is separated by the wedge portion into the supporting substrate and the active wafer without being contacted with the bonding surfaces until the flat portions are in contact with the periphery of the bonded wafer.

REFERENCES:
patent: 1048412 (1912-12-01), Hutchinson
patent: 1242392 (1917-10-01), Underwood
patent: 1338539 (1920-04-01), Volz
patent: 1412743 (1922-04-01), Herfjord
patent: 1556460 (1925-02-01), Thill
patent: 1915269 (1933-06-01), Carver
patent: 2444097 (1948-06-01), Grant
patent: 3997957 (1976-12-01), Tone et al.
patent: 5783022 (1998-07-01), Cha et al.

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