Jet etch method for decapsulation of molded devices

Details Jet etch method for decapsulation of molded devices Jet etch method for decapsulation of molded devices

1982-03-12

1983-05-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29575, 156640, B29C 1708, C03C 1500, C03C 2506, B44C 122

Patent

active

043849172

ABSTRACT:
A jet etch apparatus and method for decapsulation of molded devices having an etching block through which an etchant solution is drawn. The etchant solution which flows through the etching block forms a jet spray that impinges upon a device to be decapsulated. The etchant solution is drawn through the etching block by means of suction created by a jet pump. The decapsulation process is monitored by detecting current flow between an electrode in the etchant solution and the device. The imposed current also serves to limit excessive oxidation of aluminum pads within the device, thereby preventing attack of the aluminum by the etchant.

REFERENCES:
patent: 3112554 (1963-12-01), Teszner
patent: 3947952 (1976-04-01), Miller et al.
patent: 3969813 (1976-07-01), Minetti et al.
patent: 4089704 (1978-05-01), Heiss et al.

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