Isotropic polycrystalline silicon

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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Details

C257S066000, C257S075000, C257SE33003, C257SE29292, C257SE21133, C438S187000, C438S482000, C438S487000

Reexamination Certificate

active

11099198

ABSTRACT:
A high-quality isotropic polycrystalline silicon (poly-Si) and a method for fabricating high quality isotropic poly-Si film are provided. The method includes forming a film of amorphous silicon (a-Si) and using a MISPC process to form poly-Si film in a first area of the a-Si film. The method then anneals a second area, included in the first area, using a Laser-Induced Lateral Growth (LILaC) process. In some aspects, a 2N-shot laser irradiation process is used as the LILaC process. In some aspects, a directional solidification process is used as the LILaC process. In response to using the MISPC film as a precursor film, the method forms low angle grain boundaries in poly-Si in the second area.

REFERENCES:
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patent: 6337233 (2002-01-01), Yang
patent: 6512247 (2003-01-01), Suzuki et al.
patent: 6692996 (2004-02-01), Lee et al.
patent: 6727121 (2004-04-01), Joo et al.
patent: 6755909 (2004-06-01), Jung
patent: 7132375 (2006-11-01), Yamazaki
patent: 7138658 (2006-11-01), Yamazaki et al.

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