Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2005-12-13
2005-12-13
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S221000, C438S296000, C438S359000
Reexamination Certificate
active
06974755
ABSTRACT:
A semiconductor isolation trench includes a substrate and a trench formed therein. The trench is lined with a nitrogen-containing liner and filled with a dielectric material. The nitrogen-containing liner preferably contacts the active region of a device, such as a transistor, located adjacent to the trench.
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Ge Chung-Hu
Ko Chih-Hsin
Lee Wen-Chin
Yeo Yee-Chia
Picardat Kevin M.
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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