Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2008-12-02
2011-11-08
Fahmy, Wael (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S508000, C257SE23011, C257SE23141
Reexamination Certificate
active
08053902
ABSTRACT:
An integrated circuit structure includes a semiconductor substrate; and an interconnect structure overlying the semiconductor substrate. A solid metal ring is formed in the interconnect structure, with substantially no active circuit being inside the solid metal ring. The integrated circuit structure further includes a through-silicon via (TSV) having a portion encircled by the solid metal ring. The TSV extends through the interconnect structure into the semiconductor substrate.
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Chen Ming-Fa
Lin Sheng-Yuan
Fahmy Wael
Jefferson Quovaunda V
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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