Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1993-06-04
1995-03-21
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428210, 310 40MM, 310309, B32B 900
Patent
active
053994159
ABSTRACT:
A process for fabricating mechanically interconnected, released, electrically isolated metal microstructures, and circuit components and actuators produced by the process. A dielectric stack on a substrate is patterned and etched to produce trenches in which a metal such as tungsten is deposited. The dielectric is removed from selected regions of the metal to expose metal beams, and to form mechanically interconnecting, electrically insulating hinges supporting the beams. The beams and hinges are then released for relative motion. Electrical potentials may be established between adjacent beams to produce controlled motion.
REFERENCES:
patent: 4437226 (1984-03-01), Soclof
patent: 4668865 (1987-05-01), Gimzewski et al.
patent: 4706374 (1987-11-01), Murakami
patent: 4746621 (1988-05-01), Thomas et al.
patent: 4772928 (1988-09-01), Dietrich et al.
patent: 4845048 (1989-07-01), Tamaki et al.
patent: 5015906 (1991-05-01), Cho
patent: 5045152 (1991-09-01), Sickafus
patent: 5070317 (1991-12-01), Bhagat
patent: 5072288 (1991-12-01), MacDonald
patent: 5126812 (1992-06-01), Greiff
patent: 5179499 (1993-01-01), MacDonald
patent: 5206557 (1993-04-01), Bobbio
Wilson, Stoll and Calacone, "Highly Selective, High Rate Tungsten Deposition", 1985, pp. 35-42.
Zhang et al., "An RIE Process for Submicron, Silicon Electromechanical Structures", 1991, pp. 520-523.
Moriya et al., "A Planar Metallization Process--Its Application to . . . ", Jul. 1983, pp. 550-553.
Arney et al., "Formation of Submicron Silicon-on-Insulator . . . ", J. Vac. Sci. Technol. B 6(1), Jan./Feb. 1988, pp. 341-345.
Wilson et al., "Highly Sensitive, High Rate Tungsten Deposition", Materials Research Society, 1985, pp. 35-42.
Zhang et al., "A RIE Process for Submicron, Silicon Electromechanical Structures", J. Micromech. Microen. 2 (1992) 31-38.
Chen Liang-Yu
MacDonald Noel C.
Cornell Research Foundation Inc.
Jewik Patrick
Ryan Patrick J.
LandOfFree
Isolated tungsten microelectromechanical structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Isolated tungsten microelectromechanical structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolated tungsten microelectromechanical structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1147864