Ion milling end point detection method and apparatus

Details Ion milling end point detection method and apparatus Ion milling end point detection method and apparatus

1994-06-20

1997-11-25

Nguyen, Nam

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 216 60, 20429832, 20419233, H01L 21306, G01N 2100

Patent

active

056907842

ABSTRACT:
An ion milling end point detection method for etching coated substrates is disclosed comprising the use of a light measurement of light passing through a monitor substrate (e.g., glass coated with the same material at about the same thickness as the coated substrate to be etched) during the milling process, comparing the light values with a reference value and determining the end point of the milling process based on said values. Coated and uncoated monitor substrates may also be employed together and the values compared to determine the end point. An apparatus for determining the end point of an ion milling process is also disclosed.

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IBM Technical Disclosure Bulletin vol. 34, No. 2 Jul. 1991.

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