Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Reexamination Certificate
2008-03-26
2010-10-05
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
C438S318000, C438S331000, C438S338000, C438S342000, C438S350000, C257SE21350, C257SE21352, C257SE21361
Reexamination Certificate
active
07807539
ABSTRACT:
Methods for forming a bipolar junction transistor device are described herein. A method for forming the bipolar junction transistor device may include doping a first portion of a substrate with a first dopant to form a base pick-up region, and after doping the first portion of the substrate, doping a second portion of the substrate with a second dopant to form at least one emitter region. A bipolar junction transistor device may include a floating collector, in which case the bipolar junction transistor device may be operated as a diode for improved emitter current.
REFERENCES:
patent: 7618871 (2009-11-01), Meinhardt et al.
patent: 2004/0227213 (2004-11-01), Chen
patent: 2007/0278515 (2007-12-01), Hurst
patent: 2007/0278612 (2007-12-01), Williams et al.
Chang Runzi
Lee Peter
Lee Winston
Sutardja Pantas
Wei Chien-Chuan
Ahmadi Mohsen
Garber Charles D
Marvell International Ltd.
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