Interposer, semiconductor chip mounted sub-board, and...

Details Interposer, semiconductor chip mounted sub-board, and... Interposer, semiconductor chip mounted sub-board, and...

2006-07-12

2008-09-02

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S786000

Reexamination Certificate

active

07420206

ABSTRACT:
A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.

REFERENCES:
patent: 6919631 (2005-07-01), Hoffman et al.
patent: 7309913 (2007-12-01), Shim et al.
patent: 2001/0026014 (2001-10-01), Sakamoto et al.
patent: 2005/0194673 (2005-09-01), Kwon et al.
patent: 2005/0230800 (2005-10-01), Do et al.
patent: 2006/0060959 (2006-03-01), Hayashi et al.
patent: 2006/0091520 (2006-05-01), Akram
patent: 2006/0113653 (2006-06-01), Xiaoqi et al.
patent: 2007/0132080 (2007-06-01), Nakashima et al.
patent: 2007/0278648 (2007-12-01), Akram
patent: 2001-196529 (2001-07-01), None
patent: 2002-040095 (2002-02-01), None
patent: 2003-249606 (2003-09-01), None
“Part One: If a Chip Can Not be Used, There is a Package”, Nikkei Electronics, Feb. 11, 2002, pp. 108-113, No. 815, Nikkei Business Publications, Inc., Chiyoda-ku, Tokyo, Japan. (Cited on p. 1, line 22 of the specification).

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