Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-10-20
2008-12-09
Chu, Chris C. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257SE23068, C257S685000, C257S723000, C257S737000, C174S260000, C174S262000, C029S843000
Reexamination Certificate
active
07462939
ABSTRACT:
In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance with the present invention includes a substrate, preferably flexible, having first and second oppositely facing surfaces. Such interposers also include an array of links traversing from the first surface of the substrate to the second surface of the substrate. In accordance with the present invention, each link preferably comprises a buried portion positioned between the first and second surfaces of the substrate. In other aspects of the present invention, microelectronic assemblies having first and second microelectronic components interconnected by an interposer and methods of interconnecting such components are provided.
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Chu Chris C.
Fogg & Powers LLC
Honeywell International , Inc.
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