Internally shielded dynamic random access memory cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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365182, H01L 2170

Patent

active

054752477

ABSTRACT:
In the manufacturing process of a Dynamic Random Access Memory cell, the conducting layer used for preventing the capacitive coupling between a bit line and a word line is formed over the surface of the entire memory cell excepting the contact region of a bit line and a storage electrode. Moreover, as the conducting layer used for preventing the capacitive coupling is used as an etching barrier in the etching process forming a contact hole, self-aligned contacts are formed. Therefore, the operation of the unwanted cell of a Dynamic Random Access Memory cell caused by the capacitive coupling is protected and a highly integrated Dynamic Random Access Memory cell is manufactured.

REFERENCES:
patent: 5084406 (1992-01-01), Rhodes et al.
patent: 5100826 (1992-03-01), Dennison
patent: 5114873 (1992-05-01), Kim et al.
patent: 5140389 (1992-08-01), Kimura et al.
patent: 5151878 (1992-09-01), Yamada et al.
patent: 5292677 (1994-03-01), Dennison
patent: 5352621 (1994-10-01), Kim et al.

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