Internally cooled target assembly for magnetron sputtering

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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20429812, 2042982, 20429822, C23C 1434

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active

059851155

ABSTRACT:
An internally cooled target assembly for use in a magnetron sputtering apparatus is provided. The internally cooled target assembly includes a cooling plate that is configured to promote highly turbulent coolant flow through the target assembly to achieve efficient and uniform target cooling. The volume of coolant required to cool the target assembly is minimized.

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