Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-07-16
1992-05-19
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156652, 156656, 156657, 156663, 437187, 437235, 437245, H01L 2100
Patent
active
051145308
ABSTRACT:
A process for the fabrication of integrated circuits, wherein the interlevel dielectric material is partially etched back prior to reflow. This provides a pre-reflow profile which prevents filament problems in subsequently-patterned conductor levels, and which also avoids cracking of the interlevel dielectric during reflow.
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Mitchell Allan T.
Paterson James L.
Rao Kalipatnam V.
Barndt B. Peter
Dang Thi
Donaldson Richard L.
Kesterson James C.
Simmons David A.
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