Electrical computers and digital processing systems: memory – Addressing combined with specific memory configuration or... – For multiple memory modules
Reexamination Certificate
2006-11-21
2006-11-21
Padmanabhan, Mano (Department: 2188)
Electrical computers and digital processing systems: memory
Addressing combined with specific memory configuration or...
For multiple memory modules
C711S157000
Reexamination Certificate
active
07139862
ABSTRACT:
An interleaving method and apparatus provides parallel access in a linear and interleaved order to a predetermined number of stored data samples. A memory array with a plurality of memory devices is addressed by applying a first portion of an address to memory devices and by using a second portion of the address to select at least one memory device to be accessed, wherein the position of the first and second portions within the address is changed in response to a change between the linear order and the interleaved order. Due to the fact that the memory array is split into several individually addressable memory devices, each of these memory devices can be accessed in a linear and interleaved order by changing an allocation of a chip selection portion and a chip addressing portion of the address.
REFERENCES:
patent: 6392572 (2002-05-01), Shiu et al.
patent: 6453380 (2002-09-01), Van Lunteren
patent: 6473808 (2002-10-01), Yeivin et al.
patent: 2002/0128037 (2002-09-01), Schmidt
patent: 2003/0018942 (2003-01-01), Seo
patent: 2003/0063502 (2003-04-01), Merritt et al.
patent: 2003/0225985 (2003-12-01), Suzuki et al.
Giulietti, et al.; “Parrallel Turbo Coding Interleavers: Avoiding Collisions in Accesses to Storage Elements”; Electronics Letters, vol. 38, No. 5, Feb. 28, 2002, pp. 232-234.
Kwak, et al.; “Design Of Dividable Interleaver For Parallel Decoding In Turbo Codes”; Electronics Letters, vol. 38, No. 22, Oct. 24, 2002 pp. 1362-1364.
Richter, et al..; “Parallel Interleaving on Parallel DSP Architectures”; IEEE, Oct. 16, 2002, pp. 195-200.
Nokia Corporation
Squire Sanders & Dempsey L.L.P.
Walter Craig E
LandOfFree
Interleaving method and apparatus with parallel access in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interleaving method and apparatus with parallel access in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interleaving method and apparatus with parallel access in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3688906