Interlayer interconnect of three-dimensional memory and...

Details Interlayer interconnect of three-dimensional memory and... Interlayer interconnect of three-dimensional memory and...

2006-06-12

2008-11-04

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S588000, C438S129000, C257S773000, C257SE21627, C257SE21641

Reexamination Certificate

active

07446038

ABSTRACT:
An interlayer interconnect structure of a three-dimensional memory includes memory cell groups, each composed of a plurality of memory cells and connected to their respective selection transistors, because of special arrangement of lines and first plugs as well as line layouts. The line layouts involve disposing a plurality of lines on each of a plurality of horizontal levels, and selectively forming second plugs between adjoining lines disposed on upper and lower horizontal levels, such that the plugs selectively connect the adjoining upper and lower lines to each other. Since identical layout patterns are adopted in individual stacking states of stacking layers disposed in the three-dimensional memory, the upper lines and the lower lines of the stacking layers of the three-dimensional memory share the same layouts, leading to a reduction in the number of masks used, simpler process adjustment, and lower costs.

REFERENCES:
patent: 6501127 (2002-12-01), Mori
patent: 6984861 (2006-01-01), Yamada et al.
patent: 2005/0127519 (2005-06-01), Scheuerlein et al.
patent: 2005/0133875 (2005-06-01), Zhang
patent: 2004-362753 (2004-12-01), None

Affiliated with

Also associated with

Rating

Interlayer interconnect of three-dimensional memory and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interlayer interconnect of three-dimensional memory and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interlayer interconnect of three-dimensional memory and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4036645