Interlayer dielectric film, and method for forming the same...

Details Interlayer dielectric film, and method for forming the same... Interlayer dielectric film, and method for forming the same...

2005-06-07

2005-06-07

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C428S209000, C428S458000

Reexamination Certificate

active

06903006

ABSTRACT:
The interlayer dielectric film made of a three-dimensionally polymerized polymer is formed by polymerizing: first cross-linking molecules having three or more sets of functional groups in one molecule providing a three-dimensional structure; and a second cross-linking molecule having two sets of functional groups in one molecule providing a two-dimensional structure. In the three-dimensionally polymerized polymer, dispersed are a number of molecular level pores formed by the polymerization of the first and second cross-linking molecules.

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patent: 5962113 (1999-10-01), Brown et al.
patent: 6162838 (2000-12-01), Kohl
patent: 6319854 (2001-11-01), Aoi
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patent: 11-214382 (1999-08-01), None
patent: 200-077399 (2000-03-01), None
patent: 2000-080272 (2000-03-01), None

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