Interlaminate adhesion between polymeric materials and electroly

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156643, 156151, 1562726, 156902, B32B 3128, C25D 100

Patent

active

048103268

ABSTRACT:
A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.

REFERENCES:
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4654115 (1987-03-01), Egitto et al.
patent: 4689111 (1987-09-01), Chan et al.

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