Intergrated circuit substrates

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430 5, 430 22, 430394, 437229, 355 53, G03C 500

Patent

active

048699985

ABSTRACT:
An integrated circuit substrate is made by exposing a mask to a composite representation of the pattern of integration of several different dice. The mask is exposed several times to produce several composite representations on the mask. Several different composite representations may be formed on the same mask. Identical aligned composite representations are checked by optically comparing corresponding dice in different composite representations via respective optical systems. The several composite representations on the mask are transferred simultaneously to the substrate to reproduce the pattern of integration of the dice at a plurality of locations in the substrate. The area of the mask covered by the composite representations may be greater than the usable area of the substrate such that for at least two of the composite representations only a portion of the composite representations is reproduced on the substrate, some of those dice not reproduced in one of the composite representations being reproduced in the other of the two composite representations. One half of the mask may have composite representations relating to one processing step, while the other half of the mask relates to a different processing step, the mask being reoriented after the first step so that the part of the substrate exposed initially to the one half of the mask is subsequently exposed to the other half of the mask, the other part of the substrate being rejected.

REFERENCES:
patent: 3716296 (1973-02-01), Springer et al.
patent: 4343877 (1982-08-01), Chiang
patent: 4442188 (1984-04-01), Chiang
patent: 4488806 (1984-12-01), Takahashi et al.
patent: 4577958 (1986-03-01), Phillips
patent: 4610940 (1986-09-01), Araihara
patent: 4702592 (1987-10-01), Geiger et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Intergrated circuit substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Intergrated circuit substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Intergrated circuit substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-187190

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.