Interferometric method and apparatus for measuring etch rate and

Details Interferometric method and apparatus for measuring etch rate and Interferometric method and apparatus for measuring etch rate and

1982-08-27

1984-06-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 156345, 204192E, 204298, 356355, 356382, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

044540019

ABSTRACT:
A method and apparatus for measuring etch depth during the etching of a device pattern into a nontransparent substrate, is disclosed. The method makes use of the finding that the device patterns etched into substrates produce diffraction patterns when illuminated. Thus, according to the method, a beam of light is directed onto a region of a substrate, into which region a portion of a device pattern is being etched. The light reflected from this region forms a diffraction pattern and, according to the inventive method, the intensity of a diffraction order is detected and recorded as a function of time during the etching procedure. The intensity of the diffraction order varies with time. The etch rate of the substrate is inversely proportional to the period of the oscillations in the recorded intensity-time curve.

REFERENCES:
patent: 4039370 (1977-08-01), Kleinknecht
patent: 4198261 (1980-04-01), Busta et al.
patent: 4208240 (1980-06-01), Latos
patent: 4367044 (1983-06-01), Booth et al.
Solid State Technology, vol. 22, No. 2, 1979, pp. 61-64, Plasma Etch Monitoring with Laser Interferometry by Busta et al.

Affiliated with

Also associated with

Rating

Interferometric method and apparatus for measuring etch rate and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interferometric method and apparatus for measuring etch rate and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interferometric method and apparatus for measuring etch rate and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-120193