Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-11-30
1997-07-22
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566571, 1566621, 20419237, 437228, H01L 213105
Patent
active
056500408
ABSTRACT:
An improved interface between a TEOS or silane nitrous oxide dielectric layer and a noble metal film such as a platinum film is provided by etching an upper surface of the dielectric layer prior to depositing the metal film thereon. The interface exhibits increased adhesion compared to similar interfaces formed without an etch of an upper surface of a dielectric layer prior to metal film deposition.
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Cote, W.J. et al. "Enhanced Adhesion to Interlevel Polymide" IBM Tech. Discl. Bull. vol. 26, No. 7A, p. 3104 Dec. 1983.
Alanko Anita
Breneman R. Bruce
Micro)n Technology, Inc.
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