Interface device for thermally coupling an integrated circuit to

Details Interface device for thermally coupling an integrated circuit to Interface device for thermally coupling an integrated circuit to

1989-10-16

1992-09-29

James, Andrew J.

357 80, 357 82, H01L 3902, H01L 2302, H01L 2504

Patent

active

051517779

ABSTRACT:
An interface device for thermally coupling an integrated circuit to a heat sink having a first material characterized by high thermal conductivity such as copper, where the copper completely surrounds a plurality of inner core regions. The plurality of inner core regions contain a low coefficient of thermal expansion material and are primarily disposed in the copper material in the region directly under the integrated circuit. The low expansion regions retard thermal expansion of the interface device during exposure to variations in the temperature, yet there are continuous paths of copper provided between the integrated circuit and heat sink to promote efficient heat transfer between the silicon chip to the heat sink through the high conductivity copper. In addition, high thermal resistance layers are provided for dielectric isolation between an integrated circuit chip and heat sink, when necessary, using this invention. This interface device is characterized by enhanced thermal dissipation yet provides a compatible coefficient of thermal expansion with the silicon integrated circuit and underlying heat sink.

REFERENCES:
patent: 3399332 (1968-08-01), Savolainen
patent: 3846824 (1974-11-01), Bell
patent: 3969754 (1976-07-01), Kaniya et al.
patent: 4196442 (1980-04-01), Kaniya et al.
patent: 4283464 (1981-08-01), Hascoe
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4401798 (1983-08-01), Larker
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4450471 (1984-05-01), Wellhoefer et al.
patent: 4482912 (1984-11-01), Chiba et al.
patent: 4521801 (1985-06-01), Kato et al.
patent: 4554575 (1985-11-01), Lucas
patent: 4811166 (1989-03-01), Alvarez et al.

Affiliated with

Also associated with

Rating

Interface device for thermally coupling an integrated circuit to does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interface device for thermally coupling an integrated circuit to, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interface device for thermally coupling an integrated circuit to will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1972715