Interface adhesive

Details Interface adhesive Interface adhesive

2005-05-03

2005-05-03

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S687000, C257S692000, C257S693000, C257S706000, C257S712000, C257S714000, C156S307500, C524S440000, C523S458000

Reexamination Certificate

active

06888257

ABSTRACT:
The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

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