Interconnections for integrated circuits

Details Interconnections for integrated circuits Interconnections for integrated circuits

2011-05-31

2011-05-31

Whitmore, Stacy A (Department: 2825)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C716S119000, C257S773000

Reexamination Certificate

active

07951703

ABSTRACT:
An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.

REFERENCES:
patent: 5955788 (1999-09-01), Iwasa
patent: 5963831 (1999-10-01), Fu
patent: 6548902 (2003-04-01), Suzuki et al.
patent: 2002/0127846 (2002-09-01), Burrell et al.

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