Interconnections for a semiconductor device

Details Interconnections for a semiconductor device Interconnections for a semiconductor device

2005-12-13

2005-12-13

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S460000, C438S462000

Reexamination Certificate

active

06974725

ABSTRACT:
A method for forming an electrical contact for a semiconductor device comprises the steps of providing a semiconductor wafer section having a major surface with a plurality of conductive pads thereon and electrically coupling each pad with an elongated electrical interconnect. Next, each electrical interconnect is encased in a dielectric and the dielectric is sectioned to expose a portion of each interconnect. An inventive structure which can be formed by the inventive method is also described.

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