Interconnection structure of electronic parts

Details Interconnection structure of electronic parts Interconnection structure of electronic parts

1996-05-03

1997-06-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257738, 257778, 257780, H01L 2348, H01L 2352

Patent

active

056400527

ABSTRACT:
An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads of a semiconductor chip and pads of a substrate are connected to each other by solder bumps. The solder bumps are hourglass-shaped. Metal core members are provided in the solder bumps, respectively. The core member is constituted with a circular bottom portion and a circular pin portion. The core member is soldered to the pad of the semiconductor chip by solder.

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Matsui et al. "VLSI Chip Interconnection Technology Using Stacked Solder Bumps", Proc. IEEE 37th Electronic Components Conference, pp. 573-578. no date.

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