Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-05-08
1999-03-16
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257738, H01L 2348
Patent
active
058834389
ABSTRACT:
An interconnection structure for bonding a semiconductor device on a substrate includes a semiconductor chip having a plurality of solder balls attached thereto; and an under-fill substance layer being adjacently bonded to the semiconductor chip and having a plurality of holes therein. By employing the structure, when the semiconductor chip and the substrate are electrically bonded, a previously provided under fill substance layer is used without any additional under filling step, so that the entire process can be simplified and its reliability can be improved.
REFERENCES:
patent: 5111279 (1992-05-01), Pasch et al.
"Apparatus for Solder Ball Alignment and Containment", IBM Technical Disclosure Bulletin, vol. 38 No. 12, Dec. 1995.
Brown Peter Toby
LG Semicon Co. Ltd.
Potter Roy
LandOfFree
Interconnection structure for attaching a semiconductor to subst does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interconnection structure for attaching a semiconductor to subst, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection structure for attaching a semiconductor to subst will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-820287