Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-01-19
1997-12-30
Fahmy, Wael
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257780, H01L 2348
Patent
active
057034060
ABSTRACT:
An interconnection structure for bonding a semiconductor device on a substrate includes a semiconductor chip having a plurality of solder balls attached thereto; and an under-fill substance layer being adjacently bonded to the semiconductor chip and having a plurality of holes therein. By employing the structure, when the semiconductor chip and the substrate are electrically bonded, a previously provided under fill substance layer is used without any additional under filling step, so that the entire process can be simplified and its reliability can be improved.
REFERENCES:
IBM Technical Disclosure Bulletin, vol. 38 No. 12 Dec. 1995.
Fahmy Wael
LG Semicon Co. Ltd.
Potter Roy
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