Interconnection pattern design

Details Interconnection pattern design Interconnection pattern design

2007-05-29

2007-05-29

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000

Reexamination Certificate

active

10847409

ABSTRACT:
An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered corners. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.

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