Interconnection of through-wafer vias using bridge structures

Details Interconnection of through-wafer vias using bridge structures Interconnection of through-wafer vias using bridge structures

2005-01-26

2009-10-27

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S619000, C438S424000, C438S637000

Reexamination Certificate

active

07608534

ABSTRACT:
Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.

REFERENCES:
patent: 4499655 (1985-02-01), Anthony
patent: 4921157 (1990-05-01), Dishon et al.
patent: 5089880 (1992-02-01), Meyer et al.
patent: 5229647 (1993-07-01), Gnadinger
patent: 5314572 (1994-05-01), Core et al.
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5345824 (1994-09-01), Sherman et al.
patent: 5355022 (1994-10-01), Sugahara et al.
patent: 5417111 (1995-05-01), Sherman et al.
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 5540095 (1996-07-01), Sherman et al.
patent: 5545912 (1996-08-01), Ristic et al.
patent: 5610431 (1997-03-01), Martin
patent: 5620931 (1997-04-01), Tsang et al.
patent: 5872496 (1999-02-01), Asada et al.
patent: 5929497 (1999-07-01), Chavan et al.
patent: 5939633 (1999-08-01), Judy
patent: 6071389 (2000-06-01), Zhang
patent: 6087719 (2000-07-01), Tsunashima
patent: 6118181 (2000-09-01), Merchant et al.
patent: 6153839 (2000-11-01), Zavracky et al.
patent: 6236115 (2001-05-01), Gaynes et al.
patent: 6239495 (2001-05-01), Sakui et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6303986 (2001-10-01), Shook
patent: 6307169 (2001-10-01), Sun et al.
patent: 6323550 (2001-11-01), Martin et al.
patent: 6335224 (2002-01-01), Peterson et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6384353 (2002-05-01), Huang et al.
patent: 6406934 (2002-06-01), Glenn et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 6433411 (2002-08-01), Degani et al.
patent: 6436853 (2002-08-01), Lin et al.
patent: 6448109 (2002-09-01), Karpman
patent: 6448622 (2002-09-01), Franke et al.
patent: 6452238 (2002-09-01), Orcutt et al.
patent: 6504253 (2003-01-01), Mastromatteo et al.
patent: 6505511 (2003-01-01), Geen et al.
patent: 6512300 (2003-01-01), Cheever et al.
patent: 6548391 (2003-04-01), Ramm et al.
patent: 6559530 (2003-05-01), Hinzel et al.
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6621168 (2003-09-01), Sundahl et al.
patent: 6625367 (2003-09-01), Coult et al.
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6633079 (2003-10-01), Cheever et al.
patent: 6686642 (2004-02-01), Regan et al.
patent: 6743656 (2004-06-01), Orcutt et al.
patent: 6744127 (2004-06-01), Hedler et al.
patent: 6753208 (2004-06-01), MacIntyre
patent: 6781239 (2004-08-01), Yegnashankaran et al.
patent: 6791193 (2004-09-01), Watanabe et al.
patent: 6852926 (2005-02-01), Ma et al.
patent: 6853067 (2005-02-01), Cohn et al.
patent: 6906395 (2005-06-01), Smith
patent: 6909146 (2005-06-01), Linn et al.
patent: 6911727 (2005-06-01), Martin et al.
patent: 6933163 (2005-08-01), Yun et al.
patent: 6936918 (2005-08-01), Harney et al.
patent: 6940636 (2005-09-01), Felton
patent: 6962835 (2005-11-01), Tong et al.
patent: 6964882 (2005-11-01), Yun et al.
patent: 7034393 (2006-04-01), Alie et al.
patent: 7275424 (2007-10-01), Felton et al.
patent: 7291561 (2007-11-01), Ma et al.
patent: 7291925 (2007-11-01), Han et al.
patent: 7334491 (2008-02-01), Rudhard et al.
patent: 2001/0028114 (2001-10-01), Hosomi
patent: 2002/0056925 (2002-05-01), Kang et al.
patent: 2003/0038327 (2003-02-01), Smith
patent: 2004/0016989 (2004-01-01), Ma et al.
patent: 2004/0077117 (2004-04-01), Ding et al.
patent: 2004/0077154 (2004-04-01), Nagarajan et al.
patent: 2004/0157407 (2004-08-01), Tong et al.
patent: 2004/0219763 (2004-11-01), Kim et al.
patent: 2004/0232500 (2004-11-01), Rudhard et al.
patent: 2005/0003652 (2005-01-01), Ramanathan et al.
patent: 2005/0104187 (2005-05-01), Polsky et al.
patent: 2005/0104228 (2005-05-01), Rigg et al.
patent: 2005/0170609 (2005-08-01), Alie et al.
patent: 2005/0186705 (2005-08-01), Jackson et al.
patent: 2005/0269678 (2005-12-01), Martin et al.
patent: 2006/0043569 (2006-03-01), Benson et al.
patent: 2006/0046475 (2006-03-01), Wark et al.
patent: 2006/0118946 (2006-06-01), Alie et al.
patent: 2007/0069391 (2007-03-01), Gritti
patent: 0 851 492 (1998-07-01), None
patent: 1 219 565 (2002-07-01), None
patent: 1 296 374 (2003-03-01), None
patent: 2006 186179 (2006-07-01), None
patent: WO 96/13062 (1996-05-01), None
patent: WO 01/56921 (2001-08-01), None
patent: WO 02/093122 (2002-11-01), None
patent: WO 2005/058749 (2005-06-01), None
Ando et al.,New Packaging Technology for SAW Device, Corporate Components Development Center, Doc. No. WA1-3, 403-406, 4 pages.
Boustedt et al.,Flip Chip as an Enabler for MEMS Packaging, 2002 Electronic Components and Technology Conference, Apr. 2002, 124-128, 5 pages.
Ok et al.,High Density, High Aspect Ratio Through-Wafer Electrical Interconnect Vias for MEMS Packaging, 2003 IEEE Transactions on Advanced Packaging, vol. 26, No. 3, Doc. No. 1521-3323, Aug. 2003, 302-309, 8 pages.
Ok et al.,Generic, Direct-Chip-Attach MEMS Packaging Design with High Density and Aspect Ratio through-Wafer Electrical Interconnect, 2002 Electronic Components and Technology Conference, Apr. 2002, 232-237, 6 pages.
Park et al.,A Novel-Low-Loss Wafer-Level Packaging of the RF-MEMS Devices, 2002 IEEE, Doc. No. 0-7803-7185, Feb. 2002, 681-684, 4 pages.
Premachandran et al.,A Novel Electrically Conductive Wafer Through Hole Fille Vias Interconnect for 3D MEMS Packaging, May 2003, 627-630, 4 pages.
Seeger et al.,Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications, 2003 Society of Photo-Optical Instrumentation Engineers, Jul. 2003, 169-177, 9 pages.
ShellBGA, Online <www.shellcase.com/pages/products-shellbga.asp>, Dec. 2, 2002, 2 pages.
Teomim et al.,An innovative approach to wafer-level MEMS packaging, Solid State Technology-semiconductor manufacturing and wafer fabrication, Dec. 2, 2002, 1-4, 4 pages.
Ziptronix White Paper,MEMS: Mainstream Process Integration, Ziptronix, 7 pages.
Cheng, C., et al., “An Efficient Electrical Addressing Method Using Through-Wafer Vias for Two-Dimensional Ultrasonic Arrays,”IEEE Ultrasonics Symposium, 2000, pp. 1179-1182.
Mitsuo Umemoto et al., “High Performance Vertical Interconnection for High-Density 3D Chip Stacking Package,” IEEE 2004 Electronic Components and Technology Conference, pp. 616-623.
Calmes, S., et al., “High Integrated 2-D Capacitive Micromachined Ultrasonic Transducers,”IEEE Ultrasonics Symposium, 1999, pp. 1163-1166.
Naotaka Tanaka et al., “Mechanical Effects of Copper Through-Vias in a 3D Die-Stacked Module,” IEEE 2002 Electronic Components and Technology Conference, pp. 473-479.
A.R. Mirza, Ph.D., “One Micron Precision, Wafer-Level Aligned Bonding for Interconnect, MEMS and Packaging Applications,” IEEE 2000 Electronic Components and Technology Conference, pp. 676-680.
Guoqiang Feng et al., “Through Wafer Via Technology for 3-D Packaging,” 2005 IEEE, 2005 6thInternational Conference on Electronic Packaging Technology, 4 pages.
Chavan et al.,A Monolithic Fully-Integrated Vacuum-Sealed CMOS Pressure Sensor, 2000 IEEE, Doc. No. 0-7803-5273-4/00, pp. 341-346.
Y. Tomita et al.,Advanced Packaging Technologies on 3D Stacked LSI Utilizing the Micro Interconnections and the Layered Microthin Encapsulation, IEEE, May 29, 2001, pp. 347-355.
Authorized Officer Götz, A.,International Search Report and the Written Opinion of the International Searching Authority, PCT/US2005/012939, Sep. 7, 2005, 12 pages.
Authorized Officer Guido Ploner,International Search Report and the Written Opinion of the International Searching Authority, PCT/US2007/080045, Dec. 6, 2007, 13 pages.
Authorized Officer Mattias Ahlstedt,International Search Report and the Written Opinion of the International Searching Authority, PCT/US2006/003673, Oct. 9, 2006, 20 pages.
Authorized Officer Götz. A,International Search Report, International Searchin

Affiliated with

Also associated with

Rating

Interconnection of through-wafer vias using bridge structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection of through-wafer vias using bridge structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection of through-wafer vias using bridge structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4100136