Interconnect system for a semiconductor chip and a substrate

Details Interconnect system for a semiconductor chip and a substrate Interconnect system for a semiconductor chip and a substrate

1994-03-14

1995-05-02

Rosenbaum, Mark

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 75, 361636, 257775, H01R 909

Patent

active

054114004

ABSTRACT:
A plurality of inserts (12) formed on a first substrate (11). A plurality of sockets (14) formed on a second substrate (13). Each socket of the plurality of sockets (14) on the second substrate (13) has a corresponding insert from the plurality of inserts (12) which physically aligns for coupling. At least one of the first (11) or second (13) substrates must be a semiconductor substrate. This arrangement allows for electrically connecting a semiconductor device or structure to another device for testing, burn-in, or final assembly.

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