Interconnect structure with dielectric barrier and...

Details Interconnect structure with dielectric barrier and... Interconnect structure with dielectric barrier and...

2007-03-27

2007-03-27

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S758000

Reexamination Certificate

active

10811186

ABSTRACT:
An interconnect structure with dielectric barrier and fabrication thereof. The interconnect structure includes a semiconductor substrate and a plurality of stacked structures formed thereon, each stacked structure including a conductive line and a conductive plug thereon. A conformal dielectric barrier is formed over the surfaces of the stacked structures and a blanket second dielectric layer is formed over the dielectric barrier to form an inter-metal layer.

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patent: 6358842 (2002-03-01), Zhou et al.
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patent: 6946391 (2005-09-01), Tsai et al.
patent: 6967156 (2005-11-01), Lim et al.

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