Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-06-19
1989-03-21
Abrams, Neil
Metal working
Method of mechanical manufacture
Electrical device making
361406, 439 74, H01R 909
Patent
active
048131296
ABSTRACT:
An interconnect structure for electrically coupling conductive paths on two adjacent, rigid substrates, such as PC boards or IC chips. The interconnect structure includes a number of buttons formed on a first substrate, and a number of contacts formed on a second substrate. The buttons are elastically deformable, and include a resilient core made from an organic material such as polyimide, and a metallic coating formed over the core. The two substrates are compressed between mounting plates such that the buttons are pressed against the contracts to make electrical contact.
REFERENCES:
patent: 3880486 (1975-04-01), Avakian
patent: 3986255 (1976-10-01), Mandal
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4403272 (1983-09-01), Larson et al.
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4581679 (1986-04-01), Smolley
IBM Bulletin, Essert, vol. 7, No. 10, p. 873, 3-1965.
IBM Bulletin, Ward, vol. 18, No. 9, p. 2817, 2-1976.
"Button Board--A New Technology Interconnect for 2 and 3 Dimensional Packaging"by R. Smolley, for presentation to ISHM, Anaheim, CA, Nov. 11-14, 1985.
"TRW's Superchip Passes First Milestone", Electronics, Jul. 10, 1986.
Abrams Neil
Hewlett--Packard Company
Hickman Paul L.
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