Interconnect having recessed contact members with penetrating bl

Details Interconnect having recessed contact members with penetrating bl Interconnect having recessed contact members with penetrating bl

1997-03-31

1999-10-05

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257739, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

059629215

ABSTRACT:
An interconnect for establishing temporary electrical communication with semiconductor dice, or packages, having contact bumps is provided. The interconnect includes patterns of contact members adapted to receive the contact bumps. Each contact member includes a recess covered with a conductive layer in electrical communication with a conductor. The recesses include a peripheral edge sized to contact a range of bump sizes and to penetrate native oxide layers on the bumps. In addition, the contact members can include blades configured to penetrate into the bumps. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare dice or chip scale packages.

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