Interconnect for integrated circuits

Details Interconnect for integrated circuits Interconnect for integrated circuits

1991-06-28

1993-08-03

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 361784, H05K 100

Patent

active

052331350

ABSTRACT:
A technique for forming metal interconnect signal lines provides for planarization of an interlevel dielectric layer. A thin layer of material which can function as an etch stop, such as a metal oxide, is formed over the interlevel dielectric. An alignment process is used to pattern and define openings through the etch stop layer where contacts to underlying conductive regions will be formed. Another insulating layer is formed over the etch stop layer, and patterned to define all interconnect signal lines. When the signal line locations are etched away, the etching process stops on the etch stop layer in regions where the signal lines will be, and continues through to the underlying conductive layer where contacts are needed. A metal refill process can be used to then form interconnects and contacts within the etched holes, followed by an anisotropic etchback to remove any metal which lies on top of the upper insulating layer. This results in interconnect and contacts having upper surfaces which are substantially coplanar with the upper insulating layer in which they are formed.

REFERENCES:
patent: 3967371 (1976-07-01), Croset et al.
patent: 4663497 (1987-05-01), Reimann
patent: 5000818 (1991-03-01), Thomas et al.
patent: 5103282 (1992-04-01), Isomura et al.

Affiliated with

Also associated with

Rating

Interconnect for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2272339