Interconnect device and method of manufacture thereof

Details Interconnect device and method of manufacture thereof Interconnect device and method of manufacture thereof

1990-06-29

1991-09-17

James, Andrew J.

357 71, 357 80, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

050499742

ABSTRACT:
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture of such components are presented. The interconnect device has two layers of circuitry, one for signal transmission and one for voltage plane. The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power or ground) plane layers.

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