Interconnect circuitry, multichip module, and methods for...

Details Interconnect circuitry, multichip module, and methods for... Interconnect circuitry, multichip module, and methods for...

2007-02-20

2007-02-20

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S687000, C257S666000

Reexamination Certificate

active

11010790

ABSTRACT:
Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. Electrical circuits and multichip modules including such circuits can be formed having one or more dielectric layers comprised of latex and one or more layers of conductive leads, one or more dielectric layers comprised of a flexible dielectric material, and one or more layers of electrically conductive material patterned to interconnect such ICs. Frames that hold ICs against a substrate may be employed to planarize their top surfaces against the substrate, as well as standard photolithographic techniques in creating conductive paths on the dielectric material between the ICs.

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