Interconnect bump for flip-chip integrated circuit including int

Details Interconnect bump for flip-chip integrated circuit including int Interconnect bump for flip-chip integrated circuit including int

1997-02-06

1999-02-16

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

058724044

ABSTRACT:
An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that extends laterally external of the standoff. The peripheral portion of the cap is used as a self-aligned mask for a photolithographic step that results in removing the metal base layer except under the standoff and the cap. The cap has a lower melting point than the standoff. Heat is applied that is sufficient to cause the cap to melt over and coat the standoff and insufficient to cause the standoff to melt. The peripheral portions of the cap and the base layer that extend laterally external of the standoff cause the melted solder to form into a generally hourglass shape over the standoff due to surface tension.

REFERENCES:
patent: 3303353 (1967-02-01), Haynes et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4427715 (1984-01-01), Harris
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4626479 (1986-12-01), Hasoi et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4970570 (1990-11-01), Agarwala et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5272376 (1993-12-01), Ueno
patent: 5349500 (1994-09-01), Casson et al.
patent: 5466635 (1995-11-01), Lynch et al.
patent: 5640052 (1997-06-01), Tsukamoto

Affiliated with

Also associated with

Rating

Interconnect bump for flip-chip integrated circuit including int does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect bump for flip-chip integrated circuit including int, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect bump for flip-chip integrated circuit including int will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2065023