Inter-level dielectrics with low dielectric constants

Details Inter-level dielectrics with low dielectric constants Inter-level dielectrics with low dielectric constants

1995-07-14

1997-08-26

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428447, 257632, B32B 900

Patent

active

056609205

ABSTRACT:
A metallization is coated with a network polymer. The network polymer may be either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.

REFERENCES:
patent: 5099053 (1992-03-01), Takaoka
patent: 5292927 (1994-03-01), Griffith et al.
patent: 5389497 (1995-02-01), Yoshioka
patent: 5468790 (1995-11-01), Papathomas
Hu et al., Fluoropolymers With Low Dielectric Constants: Triallyl Ether-Hosiloxane Resins.
Hu et al., Fluoropolymers With Low Dielectric Constants: Acrylates and Epoxies.
Hu et al., Processable Fluoropolymers With Low Dielectric Constants. 7. Epoxy Networks From a Fluorodiimidediol.
Hu et al., Polym. Mat. Sci. Eng., 72, 446-447 (1995).
Buckley et al., Low Dielectric Constant Thermosetting Resins For Microelectronics.

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