Integrating a heat spreader with an interface material...

Details Integrating a heat spreader with an interface material... Integrating a heat spreader with an interface material...

2007-05-10

2009-06-30

Rose, Kiesha L (Department: 4116)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S584000

Reexamination Certificate

active

07553702

ABSTRACT:
An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.

REFERENCES:
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 4709849 (1987-12-01), Socolowski
patent: 6206269 (2001-03-01), Olofsson
patent: 6362435 (2002-03-01), Downey et al.
patent: 6822331 (2004-11-01), Eytcheson
patent: 2002/0031868 (2002-03-01), Capote et al.
patent: 2002/0093096 (2002-07-01), Tago et al.
patent: 2004/0057479 (2004-03-01), Stephens et al.
patent: 2004/0190263 (2004-09-01), Jadhav et al.
patent: 2006/0237838 (2006-10-01), Fery et al.
Barnes, P.W. (1998). Void free die attachment for multichip modules using solder alloys. Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 7th International Conference on. IEEE, 435-440.

Affiliated with

Also associated with

Rating

Integrating a heat spreader with an interface material... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrating a heat spreader with an interface material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrating a heat spreader with an interface material... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4148399